LQFP Series_必博bibo子股份有限公司

Low-profile Quad Flat Package (LQFP) refers to a four-sided pin Flat Package with body thickness of 1.0mm or 1.4mm. Mainly suitable for the use of SMT surface mount technology in PCB installation. The distance between the pins of the package is small and the pins are thin. Generally large - scale or very large - scale integrated circuits use this form of package. Pin pitch of 0.4mm-1.0mm and pin number from 32 to 256.

Applications

LQFPs are ideal package for most IC semiconductor technologies such as ASIC, PMU controllers, MCU, gate arrays (FPGA/PLD) and PC chip sets. LQFP packages are particularly well suited for electronic systems requiring broad performance characteristics. Such applications include laptop PCs, video/audio, telecom, RF, data acquisition, set-top box, communication boards and automotive.

Features

　◆ 7*7mm-28*28 mm package sizes available

　◆ 32-256 lead counts

　◆ 0.4, 0.5, 0.65, 0.80 & 1.0 mm lead pitch available

　◆ Lead frame design capability to meet customer requirements including exposed pad

　◆ Gold, copper, and Ag alloy wires interconnect, all equipped with mass production facilities

　◆ High reliability and low cost solution

　◆ RoHS-6 (green) BOM options for 100% of product family

Key capability：

　◆ Automotive products line

　◆ The assembly process includes 2nd/3rd AOI, plasma, X-ray, IR reflow, TC, SAT, etc;

　◆ Total wires max:522 wires in MP(0.7mil Au & Cu wire).

　◆ AEC-Q006/AEC-Q001 /IATF16949 Pass

技术概述：

　LQFP（Low-profile Quad Flat Package）是指封装本体厚度为1.0或1.4mm的四侧引脚扁平封装。主要适合用SMT表面贴装技术在PCB上安装布线。该封装芯片引脚之间距离小，管脚细。一般大规模或超大规模集成电路采用这种封装形式。引脚中心距有0.4mm-1.0mm等多种规格，引脚数从32到256都有涵盖。

应用：

　LQFP是大多数IC半导体技术的理想封装，如ASIC, PMU控制器，微处理器，门阵列(FPGA/PLD)和PC芯片组等。LQFP封装特别适合需要广泛性能特性的电子系统，这些应用包括笔记本电脑，视频/音频，电信，射频，数据采集，机顶盒，通信板和汽车。

特色:

　◆ 支持 7*7mm-28*28 mm封装尺寸

　◆ 32-256个引脚数量

　◆ 支持 0.4、0.5、0.65、0.80 & 1.0 mm引脚间距

　◆ 支持定制化框架，框架散热片外露设计

　◆ 采用金线、铜线、银线互连方式，并且都设有大批量生产设施

　◆ 高可靠性和低成本解决方案

　◆ 全部采用RoHS-6（绿色）材料

关键能力：

　◆ 专业的车规生产线