WBBGA/LGA/(HS)PBGA Technology
Technology Overview
TFME’s BGA (Ball Grid Array) is a laminated substrate packaging solution that is compatible with various SMT surface mount processes in the industry. Full-size fine pitch BGA (FBGA) is suitable for different package sizes(0.8 to 25mm)， thicknesses(0.5 to 1.6mm), a broad range of ball grid array pitch (≥ 0.35 mm pitch), different number of balls for the single and multi-die layouts, stacked dies (1-16) and passive component integration designs. Thin core laminate (1 to 8 metal layers) from the strong supply chain in the industry, ultra-thin mold cap thicknesses and silicon wafer thinning to 50 µm enable next-generation tablets, smartphones, game controllers, automotive, industrial, digital and video cameras and remote devices.
TFME also provides a variety of mature LGA (Land Grid Array) solutions. TFME’s LGA is suitable for different package size (0.7 to 15mm including the special package), thickness (0.4 to 1.4mm), and standard terminal (≥ 0.4mm pitch), core and coreless processes that could offer the service from prototype design to application of RF, Wi-Fi, Bluetooth, IoT, fingerprint sensor, RFID, navigation and other products.
Features
◆ Leading edge technology and expanding package offerings provide a platform from prototype-to-production;
◆ 0.7-27mm package size available, including (HS)PBGA 23x23mm & 27x27mm;
◆ 8-1000 ball/lead counts;
◆ 0.35, 0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available;
◆ Suitable substrate for multi-die (MCM and stack) and integrated SMT structures;
◆ Outstanding flexible internal routing of signal, power, and ground for device performance and system compatibility;
◆ RoHS-6 (green) BOM options for 100% of product family
◆ Gold, coper, and silver wire interconnection method and high-volume infrastructure at TFME production facilities;
◆ Thermal conductivity epoxy (3&6W/mK) and high thermal conductivity silver paste (100W/mK) available
◆ Excellent reliability and low-cost production solutions;
◆ JEDEC Publication 95 Design Guide 4.5 (JEP95);
技术概述：
TFME的BGA（Ball Grid Array）是一种层压基板封装解决方案，兼容行业各种SMT表面贴装制程。全尺寸小节距 BGA (FBGA)适用于不同封装尺寸（0.8至25mm）、厚度(0.5至1.6mm)、各种球栅阵列节距（≥ 0.35 mm节距）、不同焊球数量、单晶片多晶片布局、堆叠晶片(1-16) 和被动元件集成等设计。行业供应链提供的薄型核心层压基板（1至8个金属层）、超薄塑封体厚度和薄至 50 微米硅晶圆，为打造下一代平板电脑、智能手机、游戏控制器、汽车、工业、数字和视频摄像头和远程设备提供解决方案。
同时TFME提供各种成熟的系统集成LGA(Land Grid Array)方案：封装尺寸0.7至15mm（含异形封装）、厚度0.4至1.4mm、标准端子节距0.4mm以上、Core和Coreless工艺制程，为射频、Wi-Fi、蓝牙、IoT、指纹识别、电子标签、定位导航等产品从设计到应用的全流程服务。
特色:
◆ 尖端技术和大量封装解决方案提供原型到生产的平台
◆ 支持 0.7-27 mm封装尺寸, 包含(HS)PBGA23x23、27x27
◆ 8-1000个焊球/引脚数量
◆ 支持 0.35、0.4、0.5、0.65、0.75、0.80 & 1.0 mm焊球节距
◆ 适用于多晶粒 (MCM、Stack) 和集成 SMT 结构的基板类封装
◆ 高度灵活的内部信号、电源和接地布线，提升器件性能和系统兼容性
◆ 全部采用 RoHS-6（绿色）材料
◆ 采用金线、铜线、银线互连方式，并且都设有大批量生产设施
◆ 支持热传导环氧基树脂 (3W&6W/mk) 和高导热银浆 (100W/mk)
◆ 高可靠性和低成本解决方案
◆ JEDEC Publication 95 Design Guide 4.5 (JEP95)
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